Package design database is reducing MEMS R&D cost

The software, called CoventorWare (TM), contains Kyocera's standard ceramic package material and design data. The standard package library includes SMD (Surface Mount Devices), S/B (Side Braze), C-DIP (Cerdip) and LCC (Leadless Chip Carrier) MEMS packages for thermo-mechanical and electrical simulations. This enables MEMS device designers to simulate the behavior of their device within the package during the development phase.
Consequently the cost of MEMS-package development, which could be up to 45% of the total development cost, can be reduced significantly. This new MEMS-package database allows designers to achieve a more robust MEMS system solution, and offers the shortest possible time from the design to market.
It is unique and valuable relationship when a software and hardware company collaborate in this way to offer the design tools required for the development of MEMS devices and thereby accelerate their growth into the market place.